Current Density Driven Morphological Transitions in Copper Powder Electrodeposition within Nitrate Electrolytes

Abstract

Powdered copper is one of the key raw materials in advanced manufacturing processes and energy-related systems, where particle morphology and surface texture directly influence compaction behavior, sintering, and the final performance of the component or electrode. In this study, the effect of current density on the morphology of electrochemically deposited copper in a nitrate-based electrolyte was systematically investigated. Copper deposition was carried out galvanostatically from an aqueous copper nitrate solution containing polyvinylpyrrolidone (PVP) as an additive, under controlled hydrodynamic and thermal conditions. In all experiments, the electrolyte temperature, copper nitrate concentration, PVP concentration, sulfuric acid content, and deposition time were kept constant, and only the current density was varied. After each test, the deposits were collected, washed, dried, and then examined by scanning electron microscopy (SEM) at two different magnification levels.